EXPERIMNTAL STUDY ON Sn-Bi-In MELT-SPUN RIBBONS FOR INTERMEDIATE-STEP SOLDERING
نویسنده
چکیده
we chose Sn10Bi, Sn10Bi10In, Sn20Bi, and Sn20Bi20In (numbers are in weight percent) rapidly solidified from melt using melt-spinning technique for intermediate –step soldering. We then investigated the structure, electrical and mechanical properties of the melt-spun ribbons using x-ray diffraction, double bridge circuit, dynamic resonance technique, and Vickers microhardeness tester. It was concluded that Sn10Bi10In as Pb-Free solder for intermediate-step soldering is the best solder in micromechanical system packaging as a hermetic sealing step. Keywords—Melt-spin technique, SnBiIn, structure, Electrical, Mechanical properties, and Step Soldering
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تاریخ انتشار 2012